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利用包套热等静压(HIP)烧结在温度900℃和压力110 MPa下烧结1 h实现了铜金刚石复合材料的制备,并对复合材料的显微结构和热学性能进行了研究。结果表明:该材料中金刚石分布均匀且未发生石墨化。随着金刚石体积分数的增大,复合材料的致密度、热导率与热膨胀系数下降。制得样品中的最高致密度和热导率分别为98.5%和305W/(m·K)~(-1)。和热压烧结(HP)及放电等离子体烧结(SPS)相比,热等静压制得的铜金刚石复合材料的热导率达到相同水平甚至更高。可见,热等静压在制备铜金刚石复合材料上具有很大潜力。
The preparation of copper diamond composites was achieved by means of hot isostatic pressing (HIP) sintering at 900 ℃ and pressure 110 MPa for 1 h. The microstructure and thermal properties of the composites were also studied. The results show that diamond is uniformly distributed and no graphitization occurs in the material. With the increase of volume fraction of diamond, the densification, thermal conductivity and thermal expansion coefficient of the composites decrease. The highest density and thermal conductivity of the prepared samples were 98.5% and 305W / (m · K) -1, respectively. The hot isostatic pressing of copper diamond composites achieved the same level of thermal conductivity or even higher thermal conductivity compared to hot press sintering (HP) and spark plasma sintering (SPS). Visible, hot isostatic pressing in the preparation of copper diamond composite material has great potential.