硅是半导体行业最常见的材料,基于硅材料的电子芯片被广泛应用于日常生活的各种设备中,从智能手机、电脑到汽车、飞机、卫星等。随着技术的发展,研究者发现通过传统的电气互联来进行芯片与系统之间的通信已经难以满足电子器件之间更快的通信速度以及更复杂系统的要求。为解决这一问题,“光”被认为是一种非常有潜力的超高速传输媒介,可用于硅基芯片以及系统间的数据通信。但是,硅作为间接带隙材料,发光效率极低,难以直接作为发光材料。 Silicon is the most common material in the semiconductor industry. Silicon based electronic chips are widely used in everyday devices, from smartphones, computers, to cars, airplanes, and satellites. As technology evolves, researchers have found that chip-to-system communication over traditional electrical interconnects has made it difficult to meet faster communication speeds and more complex system requirements between electronic devices. In order to solve this problem, “Light” is considered as a promising high-speed transmission medium for data communication between silicon-based chips and systems. However, silicon, as an indirect bandgap material, has extremely low luminous efficiency and is difficult to directly use as a light-emitting material.