随着现代半导体技术的发展,集成电路中金属互连线以及电极的特征尺寸正在向10纳米逼近。在这样小的尺度下,作为基础框架的金属形态是否能够保持类似块体材料的稳定性?若有明显差异,如何保障在如此微小的尺度下电子器件物理性能的稳定性?解决这一问题是现代集成电路产业面临的理论和技术的挑战。近日,浙江大学张泽院士负责的国家重大科研仪器项目(批准号:11327901)团队中,来自东南大学的孙立涛教授与麻省理工学院李巨教授、匹兹堡大 With the development of modern semiconductor technology, the feature sizes of metal interconnects and electrodes in integrated circuits are approaching 10 nm. In such a small scale, as the basic framework of the metal form is able to maintain the stability of similar block material? If there are significant differences, how to protect the stability of the physical properties of electronic devices in such a tiny scale? Solve this problem is The modern integrated circuit industry faces theoretical and technical challenges. Recently, Professor Zhang Litong from Southeast University and Professor Li Ju from Massachusetts Institute of Technology (MIT), Pittsburgh University