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2017年2月28日陶氏化学的全资子公司道康宁宣布新推出5种光学封装胶(OEs)。这5种产品不仅进一步丰富了道康宁快速增长的LED创新解决方案产品组合,更大大增强了当前LED封装厂商的设计灵活性。由于具有超高的热和光学稳定性,以及优化的折射率、硬度和气体阻隔性能,这5款产品还提升了超大功率LED封装方案的设计自由度,如陶瓷基SMD(surface mount device),COB(chip
February 28, 2017 Dow Corning, a wholly owned subsidiary of The Dow Chemical Company, announces the release of five new optical encapsulants (OEs). These five products not only further enrich Dow Corning’s rapidly growing portfolio of innovative LED solutions, but also greatly enhance the design flexibility of today’s LED package manufacturers. These 5 products also enhance the design freedom of ultra-high-power LED package solutions such as surface mount devices, ultra-high power LED packages, high thermal and optical stability, and optimized refractive index, hardness and gas barrier properties. COB (chip