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本文简要地介绍了用于表面组装和混合电路的膏状钎料的检验方法及基本要求。检验方法分为三大部分:膏状钎料的使用性能(外观、印刷性能,烘干及热熔性能,残渣的干燥度及清洗性能,焊球试验,金属存留量试验,铺展试验);钎剂性能(酸值、卤化物,水溶物电导率,铜镜试验,绝缘电阻试验);钎料粉性能(重量百分比,钎料成分测定,钎料粉的粒度分布,钎料粉的形状),可以考虑作为膏状钎料一般技术要求。
This article briefly describes the test methods and basic requirements for pasting pastes for surface mount and hybrid circuits. Test methods are divided into three parts: paste solder paste performance (appearance, printing properties, drying and hot-melt properties, the residue of the dry and cleaning performance, solder ball test, metal retention test, spreading test) Performance of the solder powder (acid value, halide, conductivity of water solubles, copper mirror test, insulation resistance test); properties of solder powder (weight percentage, measurement of solder composition, particle size distribution of solder powder, shape of solder powder) Can be considered as paste solder general technical requirements.