Au-Sn相关论文
本文介绍一种用于军品生产的Ag-Cu-Sn三元合金取代Au-Sn焊料作半导体器件封装材料。介绍三元合金的组成、新型清洗液的使用、封装......
Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during agin
The growth of Au-Sn intermetallic compounds(IMCs) is a major concern to the reliability of solder joints in microelectro......