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本文介绍了金属芯印制电路板的原理、结构、作用与类型,讲述了设计导热性粘接介质材料的两组数学模式及金属基覆铜箔层压板的主要性能。
This paper introduces the principle, structure, function and type of the metal core printed circuit board. It tells about two sets of mathematical models for designing the thermal conductive adhesive medium material and the main performance of the metal base copper clad laminate.