一、前言平面工艺在半导体硅器件的制造中是一项特别重要的技术,它在小功率晶体管、闸流管和集成电路等方面得到了广泛的应用。平面器件的一个特点是,其P-N结的曝露部分都用硅的氧化膜(二氧化硅)等无机绝缘膜加以复盖,所以可靠性较好。另一个特点是,几乎每个工艺都能成批地做片子,并可以用价钱便宜的塑料等进行封装,因此,制造成本较低。 I. INTRODUCTION The planar process is a particularly important technology in the manufacture of semiconductor silicon devices. It has been widely used in low-power transistors, thyristors and integrated circuits. A feature of the planar device is that the exposed portion of the P-N junction is covered with an inorganic insulating film such as a silicon oxide film (silicon dioxide), so the reliability is good. Another feature is that almost every process can be done in batches film, and can be used to package cheap plastic, etc. Therefore, the lower manufacturing costs.