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SoC还是SiP?随着复杂系统级芯片设计成本的逐步上升,系统级封装方案变得越来越有吸引力。同时,将更多芯片组合到常规外形的单个封装中的新方法也正在成为一种趋势。
SoC or SiP? As complex system-on-chip design costs escalate, system-in-package solutions become more and more attractive. At the same time, new ways of combining more chips into a single package of conventional form factor are also becoming a trend.