浅谈DO-35玻璃壳封装

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一、前言随着现代电子和航天技术的飞速发展,对半导体器件的外形大小、电性能参数等方面都提出了新的要求,尤其对半导体元器件的可靠性要求日益提高。而半导体元器件的固有可靠性与它的封装形式和封接技术有着密切的关系,封装方法的不同和封装技术的高低直接影响 I. Introduction With the rapid development of modern electronic and aerospace technologies, new requirements have been put forward on the dimensions of the semiconductor devices, electrical performance parameters and the like, and the reliability requirements of the semiconductor components are increasingly raised. The inherent reliability of semiconductor components and its packaging and sealing technology has a close relationship between the different methods of packaging and packaging technology has a direct impact on the level of
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