芯片倒装技术应用以来,人们就在研究用硅作为封装的衬底基片,其部分原因在于这样基片的热胀系数就与相匹配的硅管芯热胀系数完全一样了。硅材料目前已被使用作系统级封装(SiP)的衬底基片材料,在其上面很容易制作精细线条的互连布线。最近的一个进展则是日本公司发表了制成带有通孔的硅衬底基板的结果。 Silicon chip packaging has been studied since the flip chip technology was applied in part because the thermal expansion coefficient of the chip is exactly the same as that of a matched silicon die. Silicon materials are currently being used as substrate materials for system-in-package (SiP) substrates, on which fine-line interconnect wiring is easily made. A recent development is the result of a Japanese company publishing a silicon substrate with through-holes.