【摘 要】
：
据海外媒体报道,全球半导体业界朝物联网(IoT)等新兴领域开拓商机,惟这些新领域对芯片的需求是希望可达低成本及高功耗水准,为此业界目前发现透过全空乏绝缘上覆硅(Fully Dep
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据海外媒体报道,全球半导体业界朝物联网(IoT)等新兴领域开拓商机,惟这些新领域对芯片的需求是希望可达低成本及高功耗水准,为此业界目前发现透过全空乏绝缘上覆硅(Fully Depleted Silicon-on-Insulator;FD-SOI)制程新技术,可生产出具上述优势的芯片,是否借此有助半导体产业找到新成长契机。
According to overseas media reports, the global semiconductor industry opens up business opportunities in new emerging areas such as Internet of Things (IoT). However, the demand for chips in these new areas is expected to be low-cost and high-power consumption. For this reason, Over-silicon (Fully Depleted Silicon-on-Insulator (FD-SOI) process of new technologies, can produce these advantages of the chip, whether to help the semiconductor industry to find new growth opportunities.
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