论文部分内容阅读
本文主要对高密度、高多层埋盲孔的钻孔问题进行阐述，并主要针对高密度、高多层埋盲孔的钻孔定位方式及钻孔补偿方面进行分析，以便为高密度、高多层埋盲孔的钻孔提供参考。
浅谈高密度、高多层埋盲孔的钻孔
【摘 要】
：
本文主要对高密度、高多层埋盲孔的钻孔问题进行阐述，并主要针对高密度、高多层埋盲孔的钻孔定位方式及钻孔补偿方面进行分析，以便为高密度、高多层埋盲孔的钻孔提供参考。
【机 构】
：
汕头超声印制板公司
【出 处】
：
2004春季国际PCB技术/信息论坛
【发表日期】
：
2004年5期
其他文献
对现今的线路板行业而言，随着其产品的精细化，制程的高速化以及高分子材料的广泛应用，其生产加工制程因静电的影响所导致的良品率下降的问题越来越明显。本文介绍了静电、静电放电(ESD)的定义、相关概念和静电的产生机理，详细分析了静电对PCB品质的影响，并给出了进行静电控制的基本原则及实现方法。
Today, more than ever, an AOI process requires both inspection and verification process to produce effective, cost saving results to drive maximum yield. Verification In Parallel Technology (VIP in sh
Parallel Application of Multiple Optical Inspection Algorithms A Statistical Analysis of Detection A
The performance of automated optical inspection (AOI) systems is constantly progressing toward the ultimate goal of detecting 100％ of real defects with no false alarms. Still, until this goal is reach
随着电子行业的迅速发展，集成电路的集成度逐步提高，电路的工作速度越来越快，信号的传输速度和频率也越来越高，因而出现了阻抗匹配问题，高频信号和高速数字信号的传输对特性阻抗匹配要求越来越严格。本文主要对单端阻抗印制板生产、测试过程中积累的数据和经验进行总结，并对特性阻抗的影响因素进行分析，对阻抗的变化规律和过程控制中采取的一些措施进行阐述，给业界人士提供一个参考。
Nezt Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mized Metal Fi
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly becoming more critical, fabricators and OEMs must determine the most cost
The European Commission has adopted the RoHS directive(Restriction of the Use of Crtain Hazardous Substances in EEE-2002/95/EC,27th January 2003)The European Commission has adopted the RoHS directive(
本文通过设计并实施不同的试验方案，找到了导致板面镀层不均匀的原因．然后通过对电铜缸的清洗以及对电镀药液的碳处理，基本上解决了板面镀层不均匀和镀层不良两大问题．
Over the past year there has been consistent growth in the use of high Phosphorous - electroless Nickel / immersion Gold (HP - ENIG) as a final finish. The finish is now frequently being used for PBGA
Can peel strength predict the structural integrity of the adhesive bond between the copper and lamin
The structural integrity of a printed circuit is for the most part dependant upon the adhesive bond between the copper component and the resin glass laminate. A failure mode is normally a delamination