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[期刊论文] 作者：Soonyang Kwon,Jangryul Park,Kwangrak Kim,Yunje Cho,Myungjun Lee,
来源：光：科学与应用（英文版） 年份：2022
As smaller structures are being increasingly adopted in the semiconductor industry, the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking strategi......
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