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使用ANSYS有限元软件建立简化的基于硅通孔技术互连的二维结构模型,用粘塑性本构Anand方程来描述Sn Pb钎料焊点的力学行为,针对模型中的焊球进行热力耦合计算,研究热循环过程中的热失效问题。根据模拟的温度场、应力应变场找到危险焊点位置,利用修正Coffin-Manson经验方程估算危险焊点的热疲劳寿命,并且讨论了模型中通孔直径、深度和间距等参数对焊点热疲劳寿命的影响。结果表明,在只改变单一参数的情况下,焊点疲劳失效周期通孔各参量值的增加均呈现出下降的趋势,其中通孔直径和通孔间距的大小对焊点的使用寿命影响较大。
The finite element software ANSYS is used to establish a simplified two-dimensional structural model based on TSV interconnection. The visco-plastic constitutive Anand equation is used to describe the mechanical behavior of solder joints in Sn-Pb solder. The thermal coupling of solder balls in the model is calculated , To study the problem of thermal failure during thermal cycling. According to the simulated temperature field and stress-strain field, the location of dangerous solder joints is found. The thermal fatigue life of dangerous solder joints is estimated by the modified Coffin-Manson empirical equation. And the thermal fatigue resistance of the solder joints such as the diameter, depth and spacing of through-holes in the model is discussed The impact of life expectancy. The results show that under the condition of changing only a single parameter, the increase of the parameters of the through-hole in the fatigue failure period of the solder joint tends to decrease, and the diameter of the through-hole and the pitch of the through-hole greatly affect the service life of the solder joint .