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电子封装是连接半导体芯片和电子系统的一道桥梁,今日的电子封装不但要提供芯片保护,同时还要在一定的成本要求下不断增加产品的性能、可靠性、散热、功率分配等功能。电子封装的设计和制造对系统应用正变得越来越重要,电子封装的设计和制造从一开始就需要从系统入手以获得最佳的性能价格比。原来一些仅用于前道的封装工艺已经逐步应用于后道封装,且呈增长趋势。电子封装发展的驱动力主要来源于半导体芯片的发展和市场需要,可以概括为如下几点:速度及处理能力的增加需要更多的引脚数,更快的时钟频率和更好的电源分配。
Electronic packaging is a bridge connecting the semiconductor chip and the electronic system. Today’s electronic packaging not only provides chip protection, but also continuously increases the performance, reliability, heat dissipation and power distribution of the product under a certain cost requirement. The design and manufacture of electronic packages are becoming more and more important for system applications, and the design and manufacture of electronic packages needs to be started from the system from the very beginning to get the best price / performance ratio. Some of the original only for the first round of packaging technology has been gradually applied to the package after the package, and showed an increasing trend. The driving force behind the development of electronic packaging mainly comes from the development of semiconductor chips and market needs, which can be summarized as follows: The increase of speed and processing power needs more pins, faster clock frequency and better power distribution.