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以马来海松酸缩水甘油酯(MPTGE)为囊芯材料,正硅酸四乙酯(TEOS)为囊壁材料,采用溶胶-凝胶法制备了一种新型的有机硅包覆环氧树脂微胶囊。分别利用扫描电镜(SEM)、透射电镜(TEM)、光学显微镜(OM)、傅里叶红外光谱仪(FT-IR)、粒径分析仪及热重分析仪(TG)对微胶囊的外貌形态、结构、粒径分布及热稳定性进行了表征。研究表明,有机硅对环氧树脂芯材形成了有效的包覆,制备的微胶囊表面光滑致密,粒径分布较窄,平均粒径为8.4μm,热稳定性较好,芯材质量分数58%。
Using MPTGE as core material and tetraethylammonium orthosilicate (TEOS) as wall material, a new type of silicone-coated epoxy resin was prepared by sol-gel method capsule. The morphologies of the microcapsules were characterized by SEM, TEM, OM, FT-IR, TG and TG, respectively. Structure, particle size distribution and thermal stability were characterized. The results show that silicone has an effective coating on the epoxy resin core material. The prepared microcapsules have a smooth and compact surface with a narrow particle size distribution. The average particle size is 8.4μm, and the thermal stability is better. The core material mass fraction is 58 %.