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实现了二维C/SiC与Nb合金NbHf10-1M的可靠连接．连接时将Ti-Cu核心中间层与Cu辅助中间层构成的叠层结构置于C/SiC与Nb合金之间,并采用了固相扩散连接与瞬间液相扩散连接(Transient liquid phase-diffusion bonding,TLP-DB)相结合的连接方法．结果表明：辅助中间层厚度＞0．72mm时,可以有效缓解接头热应力．核心中间层在TLP-DB过程中形成的液相对C/SiC具有良好浸润性,可渗入C/SiC基体,并包裹位于核心中间层与C/SiC界面区域的C纤维．接头剪切强度最高为14．1MPa．
The reliable connection between two-dimensional C / SiC and Nb alloy NbHf10-1M has been achieved. When the connection is made, the laminated structure consisting of the Ti-Cu core intermediate layer and the Cu auxiliary interlayer is placed between the C / SiC and the Nb alloy, and the solid-phase diffusion connection and the transient liquid phase diffusion connection , TLP-DB) combination of the connection method. The results show that when the thickness of the auxiliary interlayer is> 0.72mm, the joint thermal stress can be effectively relieved. The liquid phase formed in the core intermediate layer during the TLP-DB process has good wettability to C / SiC, penetrates into the C / SiC matrix and encapsulates the C fibers in the core and C / SiC interface regions. Joint shear strength up to 14.1MPa.