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LED芯片结温的高低直接影响其出光效率、工作寿命和可靠性。在分析系统各个环节热阻的基础上,详细评述了高功率LED产品从芯片到系统级的热管理研究新动向,包括:自然对流冷却,采用压电风扇、电离方法所进行的强迫空气对流冷却,采用水、液态金属作为冷却工质的液冷方法,采用热管实现的相变冷却,采用热电片进行的固态冷却方案以及利用热电片对余热进行回收利用的热管热回收方案和液体金属冷却方法。并在上述基础上提出了发展更高功率密度LED热管理方法的关键科学问题。
LED chip junction temperature directly affects the level of its light efficiency, working life and reliability. Based on the analysis of the thermal resistance in all aspects of the system, the new trends in the research of thermal management of high power LED products from chip to system level are reviewed in detail. These include natural convection cooling, forced air convection cooling using piezoelectric fans and ionization methods , Liquid-cooling method using water and liquid metal as cooling medium, phase-change cooling using heat pipe, solid-state cooling scheme using thermoelectric film and heat-pipe heat recovery scheme and liquid metal cooling method utilizing heat-chip to recover waste heat . Based on the above, the key scientific problems of developing LED thermal management method with higher power density are put forward.