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《电子产品世界》2004年8月报道:世界主要半导体厂商的生产领域已可应用90nm工艺技术,为确保技术优势,已把竞争推向65～70nm级工艺,计划2005年推向量产阶段。Intel去年已采用65nm工艺试制或SRAM产品,计划2005年后投入批量生产。东芝和索尼联手开发出65nmLSI,年初已生产出试制品,2008年上半年跨入大批量生产。三星已开发70nm工艺,计划年末在30nm生产线上量产4Gb NAND内存。台积电决定2005年前采用65nm技术开发出SoC平台。采用65nm工艺生产芯片,可使芯片上集成的晶体管数翻一番,性能提高,成本下降。因此,后起半导体企业年底前也须进入90nm以下的超微细加工领域,也是今后存活半导体市场的一大关键。
Electronic Products World Reported in August 2004: 90nm process technology has been applied in the production field of major semiconductor manufacturers in the world. To ensure the technical superiority, the competition has been pushed to the 65 ~ 70nm process and is scheduled to be put into mass production in 2005. Intel last year has adopted 65nm process prototype or SRAM products, plans to put into mass production after 2005. Toshiba and Sony jointly developed a 65nmLSI, early prototype has been produced in the first half of 2008 into mass production. Samsung has developed a 70nm process and plans to mass-produce 4Gb NAND memory by the end of the 30nm line. TSMC decided to use 2005 65nm technology to develop SoC platform. The use of 65nm process chip production, the number of integrated transistors on the chip doubled, performance improvement, cost reduction. Therefore, after the end of the semiconductor business must enter the field of ultrafine processing below 90nm, but also a key to the survival of the semiconductor market in the future.