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由于高分子聚合物的原料简单易得,人们又掌握了许多将低分子转变成大分子的反应,再加上发展了许多对聚合物加工成型的新工艺,我们可以预言聚合物在未来是有发展前途的。在耐高温材料方面,迫切需要等级较高的材料,使用温度希望能达1000℃以上。长期使用温度要求在空气中能超过300℃,在惰性气体中能超过500℃。从理论上讲,这类高分子主链最好含有芳香环或其它类杂环结构,并且也希望在这类耐高温材料中,还能具有导体和半导体的性质,或再加入某些石墨化或金属活化的组成,使能显示超导体的性能。
Due to the simple and easy-to-get raw materials of high-molecular-weight polymers, many people have mastered the reaction of converting low-molecular-weight molecules into large-sized molecules. With the development of many new processes for polymer processing and forming, we can predict that the polymer is Promising future. In the high temperature materials, the urgent need for a higher level of material, the use of temperature hope to reach more than 1000 ℃. Long-term use temperature requirements in the air can exceed 300 ℃, in inert gases can exceed 500 ℃. Theoretically, such macromolecule backbones preferably contain aromatic rings or other heterocyclic structures, and it is also desirable to have conductor and semiconducting properties in such high temperature resistant materials or to add some graphitization Or metal activation composition, enabling the performance of superconductors.