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低压等离子体在半导体器件制造中的应用是一个十分活跃的研究课题.从七十年代初将等离子体技术用于去除光致抗蚀剂以后,不久就相继开发了硅材料、导电材料和掩膜材料的干法蚀刻技术以及薄膜淀积技术.干法蚀刻由于比以往的湿法工艺具有成本低、线条分辨率高、对环境污染少和自动
The application of low-pressure plasma in the manufacture of semiconductor devices is a very active research topic.From the early seventies of plasma technology for the removal of photoresist, soon after the development of silicon materials, conductive materials and masks Dry etching of materials and thin film deposition technology Dry etching due to lower cost than the previous wet process, high line resolution, less environmental pollution and automatic