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研究了在0.6×10~4A/cm~2电流密度下,A1_2O_3颗粒对Cu/SAC-A1_2O_3/Cu焊点基体组织及界面金属间化合物(IMC)层的影响规律。结果表明,SAC焊点组织随通电时间延长,由椭圆状转变为不规则的粗大块状,界面IMC层出现了显著的极化现象。SAC-A1_2O_3组织中共晶相仍呈近椭圆状弥散分布,无明显粗化现象,界面IMC层厚度也出现了极化现象,但相比于SAC焊点而言,极化程度较低。0.5wt%Al_2O_3的添加有助于提高Cu/SAC-Al_2O_3/Cu焊点抗电迁移可靠性。
The effect of A1_2O_3 particles on the microstructure and interface intermetallic compound (IMC) of Cu / SAC-Al_2O_3 / Cu solder joints at 0.6 × 10 ~ 4A / cm ~ 2 current density was studied. The results show that the microstructures of SAC solder joints change from oval to irregular coarse block with the extension of electrical conduction time, and the polarization phenomenon appears in IMC layer. The eutectic phase in SAC-A1 2 O 3 microstructure is still near elliptic dispersion with no obvious coarsening phenomenon. The thickness of interface IMC layer also shows the polarization phenomenon, but the polarization degree is lower than that of SAC solder joint. The addition of 0.5wt% Al 2 O 3 helps to improve the anti-electromigration reliability of Cu / SAC-Al 2 O 3 / Cu solder joints.