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共晶焊接设备的温度均匀性直接决定焊接电子元器件的质量,因此设备的温度场设计成为共晶焊接设备的关键。本文首先设计了由加热元件(红外灯管)、热板、反射板和隔热板组成的加热组件;其次应用试验测试和有限元仿真相结合的方法,分别讨论了两组加热元件的排布方式对于热场温度均匀性的影响;最后采用真空共晶焊接设备验证了温度场设计的可行性。实验结果表明,采用加热元件变间距排布的方式,其温度场的均匀性能达到±5℃的要求,焊接电子元件的平均孔洞率和剪切强度分别达到了1.78%和9.8kg,符合了GJB 548B-2005对于电子元器件焊接质量的要求。
The temperature uniformity of the eutectic soldering equipment determines the quality of the soldering electronic components directly, so the temperature field of the equipment is designed to be the key to eutectic soldering equipment. In this paper, the heating element composed of heating element (infrared lamp), hot plate, reflector and heat shield is designed firstly. Secondly, the combination of test and finite element simulation is used to discuss the arrangement of two heating elements Method for the thermal field temperature uniformity; Finally, the use of vacuum eutectic welding equipment to verify the feasibility of the design of the temperature field. The experimental results show that the uniformity of the temperature field can reach ± 5 ℃ by changing the pitch of heating elements. The average hole ratio and shear strength of the soldered electronic components reach 1.78% and 9.8kg, respectively, which accords with GJB 548B-2005 for the quality of electronic components welding requirements.