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芯片键合是指将划片分割后的半导体芯片粘结到管座或引线框架上去的装片工序。随着半导体器件制造的迅速发展,越来越迫切地要求改变目前的手工装片方式。 在国外市场上基本上还没有芯片键合自动化设备,这是因为各器件制造厂对半导体器件的组装所采用的方法不同,引线框的形状、电镀的种类、芯片厚度、粘接材料,芯片的送料方法等均不相同,故其设备也完全不同。因此,设备制造厂想独立制造各器件厂可通用的芯片键合机是很困难的,决定芯片键合机的规格也是很困难的。从表1所示出的影响芯片键合的各种因素及这些因素之间的相互关系可知,把芯片装到引线框上去是有多种方法的,常常是由于集成电路的特性而限制了装片的方法。另外,芯片的上料方法受到前道工序——划片、分片方法的影响,而装片方法又进一步影响引线键合的方法。
Chip bonding refers to a dicing process in which a diced semiconductor chip is bonded to a stem or a lead frame. With the rapid development of semiconductor device manufacturing, it is more and more urgent to change the current manual loading method. Basically, there are no chip bonding automation devices in foreign markets because the device manufacturers use different methods for the assembly of semiconductor devices, the shape of the lead frame, the type of plating, the thickness of the chip, the bonding material, the chip Feeding methods are not the same, so the equipment is completely different. Therefore, it is very difficult for the equipment manufacturer to independently manufacture a chip bonder which can be commonly used in various device factories. It is also difficult to determine the size of a chip bonder. From the various factors that affect chip bonding shown in Table 1 and the interrelationship between these factors, there are several ways to mount the chip on the lead frame, often due to the nature of the integrated circuit Method of the film. In addition, the loading method of the chip is affected by the front process - scribing and slicing methods, and the loading method further affects the wire bonding method.