论文部分内容阅读
一年前,中国半导体封测业同比大跌21.2%,市场和销售都跌入谷底。今天,在全球半导体行业回暖,3D、SIP封装兴起,02专项开始实施等利好影响下,封测业正迎来属于自己的幸福时光。
A year ago, China’s semiconductor IC packaging and testing industry dropped 21.2% YoY, both in sales and in the market. Today, in the global semiconductor industry pick up, 3D, SIP package rise, 02 special implementation of such favorable conditions, the IC packaging and testing industry is welcoming its own happy hour.