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本文以氰化镀铜液及酸性光亮镀铜液为例讨论微观分散的问题。根据氰化镀铜液的极化曲线及铜沉积的分极化曲线、I～(rpm)~(1/2)曲线、整平度的测定及金相显微观察,认为电极过程为浓差控制时,微观分散力差。根据酸性镀铜液及其加入H_1后极化曲线的变化、各种浓度H_1的I～(rpm)~(1/2)曲线、金相显微观察及整平度的测定,认为沉积金属是电化学过程、阻化剂对阴极表面有特性吸附、在阴极有消耗,阻化作用受其扩散速度控制时,溶液的微观分散力好,即有正整平作用。
In this paper, cyanide copper plating solution and acid bright copper plating solution as an example to discuss the issue of micro-dispersion. According to the polarization curve of copper cyanide solution and the polarization curve of copper deposition, I ~ (rpm) ~ (1/2) curve, the measurement of flatness and metallographic microscopic observation, the electrode process is considered as concentration control , Poor dispersion of microscopic. According to the changes of the polarization curves of acidic copper plating solution and its addition to H 1, the I ~ (rpm) ~ (1/2) curves of various concentrations of H 1, the metallographic observation and the flatness measurement, it is considered that the deposited metal is an electrochemical Process, the inhibitor on the cathode surface of the characteristic adsorption, consumption in the cathode, the role of resistance by its diffusion rate control, the micro-dispersion of the solution is good, that is a positive leveling effect.