现在信息时代,很重要的都是在集成电路的发展上。我们现在使用比较多的,一个是计算机的CPU处理芯片,另外一个是存储芯片。半导体芯片制造需要根据客户的要求,进行集成电路设计,把它的电路图设计出来,然后做成模板,进入晶圆的制造,经过测试之后,到后面的封装测试,就是半导体的后封装阶段。从工艺上来说,主要的生产工艺就是曝光的工艺,在前面的硅片经过碾磨以后,清洗,从感光枪到曝光机里面进行曝光, Now the information age, it is very important in the development of integrated circuits. We use more now, one is the computer’s CPU processing chip, the other is the memory chip. Semiconductor chip manufacturing needs in accordance with the requirements of customers, the design of integrated circuits, the circuit diagram of its design, and then made into a template, into the wafer manufacturing, after testing, to the back of the package test is the semiconductor post-packaging stage. From the craft point of view, the main production process is the exposure process, in the front of the silicon after grinding, cleaning, exposure from the light gun to the exposure inside the machine,