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恩智浦半导体(NXPSemiconductorsN.V.;NASDAQ:NXPI)宣布推出业界首款采可焊接式镀锡面盘的无引脚封装产品SOD882D。SOD882D为一款二引脚塑料封装产品,尺寸仅有1mm×0.6mm,是轻薄型装置的理想之选。其高度仅有0.37mm(标准值),同时也是1006尺寸(0402英寸)系列中最扁平的封装产品
NXP Semiconductors (NXPSemiconductorsNV; NASDAQ: NXPI) announces the industry’s first SOD882D leadless package with a solderable tinplate. The SOD882D is a 2-pin plastic package that measures only 1mm by 0.6mm and is ideal for thin and light devices. With a height of only 0.37mm (standard), it is also the flattest package in the 1006 size (0402 inch) family