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W/Cu功能梯度材料性能优异应用广泛,以W/Cu功能梯度材料的制备方法为研究对象,探讨不同制备方法存在的优缺点,包括熔渗法、粉末冶金法及等离子喷涂法。作为等离子体材料应与等离子体相适应,耐热冲蚀。在电子领域中,其一侧应满足与基板的封接问题,另一侧满足高导热、低热膨胀系数的要求。目前虽然研发出多种新工艺、新技术,但需进一步了解其控制因素及影响机理,另外每种工艺适用范围比较小,需开发高效、低成本、适用广、易控制的制造工艺。
W / Cu functional graded materials are widely used. The preparation methods of W / Cu functional graded materials are used to study the advantages and disadvantages of different preparation methods, including infiltration method, powder metallurgy method and plasma spraying method. As a plasma material should be compatible with the plasma, thermal erosion. In the electronics field, one side should meet the sealing problem with the substrate and the other side to meet the requirements of high thermal conductivity and low thermal expansion coefficient. At present, although a great deal of new technologies and technologies have been developed, it is necessary to know more about the controlling factors and the mechanism of their effects. In addition, the scope of application of each technology is relatively small. Therefore, it is necessary to develop manufacturing processes that are efficient, low cost, widely applicable and easy to control.