论文部分内容阅读
采用热压法将拥有超高导热率和负热膨胀系数的中间相沥青基短碳纤维(CF_s)与Cu复合,并利用化学气相沉积技术对CF_s镀铬以改善其与Cu的结合状况,研究了所制备的镀铬CF_s/Cu复合材料的显微结构与热性能。结果表明:在制备中Cr层的大部分与CF_s表层的C反应形成连续、均匀的界面薄层Cr_7C_3,少量的扩散于Cu基体中,使CF_s与Cu之间的界面由结合极差的机械结合转化成良好的冶金结合,有效地提升了复合材料的热性能。CF_s含量为40vol%～55vol%时,镀铬CF_s/Cu复合材料致密度高于97.5%,平面方向上的热导率达393～419 W(m·K)~(-1),平面方向的热膨胀系数在5.1～8.4×10~(-6) K~(-1)之间。高的热导率,低的热膨胀系数以及优良的可加工性能使其成为极有潜力的电子封装材料。
The mesophase pitch-based short carbon fiber (CF_s) with super-thermal conductivity and negative thermal expansion coefficient was composited with Cu by hot-pressing, and the CF-chrome plating was applied by chemical vapor deposition to improve its bonding with Cu. The chrome CF_s / Cu composite microstructure and thermal properties. The results show that most of the Cr layer reacts with C of the CF_s surface layer to form a continuous and uniform thin layer of Cr_7C_3 during the preparation process. A small amount of Cr_7C_3 diffuses in the Cu matrix and the interface between CF_s and Cu is mechanically bonded by poor bonding Into a good combination of metallurgical, effectively enhance the thermal properties of composite materials. When CF_s content is 40vol% ~ 55vol%, the density of chrome-plated CF_s / Cu composites is higher than 97.5%, and the thermal conductivity in plane direction is 393 ~ 419W (m · K) -1. The coefficients ranged from 5.1 to 8.4 × 10 ~ (-6) K ~ (-1). High thermal conductivity, low coefficient of thermal expansion and excellent machinability make it an extremely promising electronic packaging material.