皇家飞利浦电子公司日前宣布有三款关键的90 nm CMOS产品正式在法国 Crolles的Crolles2联盟晶圆生产厂投入大批量生产,其中一款产品每月的发货量已经超过100万片。飞利浦公司的这三款产品是用于高度集成的系统级封装(Sys- tem-in-Package(SiP))连接解决方案的基带芯片。通过这三款产品,飞利浦展示了 90 nm CMOS工艺,在缩小尺寸、降低功耗以及使其保持价格竞争力方面的优势。 Royal Philips Electronics announced the launch of three key 90 nm CMOS products in full production at the Crolles2 alliance wafer fabrication facility in Crolles, France, with a monthly shipment of more than 1 million units. The three Philips products are baseband chips for a highly integrated system-in-package (SiP) connectivity solution. With these three products, Philips demonstrated the benefits of 90 nm CMOS technology in reducing size, reducing power consumption, and keeping it price competitive.