电子工业上经常采用黄铜件锡焊成围框、中放匣或机坐上钎焊插针和接线柱,道波和腔体也常常采用锡钎焊。这些锡钎焊的零件为了满足电性能和防腐性能的要求,需要电镀银或其它金属。以前采用的镀前处理是混合酸洗之后用手工擦去黑膜,该方法劳动强度大、效率低、操作复杂、电镀质量差,复杂零件用手工无法擦去黑膜。以前曾用银焊代替锡钎焊,银焊零件镀前处理容易,同一般铜件镀前处理方法相同。但银焊与锡钎 Brass pieces are often used in the electronics industry to soldered into the enclosure, put the box or machine to sit on the soldering pins and terminals, and the wave and cavity are often made of tin brazing. These tin-brazed parts need to be electroplated with silver or other metal in order to meet electrical and corrosion protection requirements. Previously used pre-plating treatment is a mixed pickling hand wipe the black film, the method of labor-intensive, low efficiency, complex operation, poor plating quality, complex parts by hand can not wipe the black film. Previously used silver soldering instead of tin soldering, silver soldering parts before plating easy to deal with the same general copper plating the same pre-treatment method. But silver solder and solder