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英特尔(Intel)宣布将在2017年底之前启动全新22纳米鳍式场效晶体管(FinFET)制程22FFL,相关开发套件(PDK)在接下来几个月也将陆续到位,市场上认为22FFL的推出,显然是针对GlobalFoundries等业者以绝缘上覆硅(FD-SOI)为移动装置及物联网(IoT)应用所生产之同类芯片而来。据EE Times Asia报导,英特尔称自家22FFL是市场上首款为低功耗IoT应用及移
Intel is announcing a 22FFL 22-MOL FinFET process by the end of 2017, and the related development kits (PDKs) will be available in the coming months as the introduction of the 22FFL is clear Comes from the same kind of chips produced by companies such as GlobalFoundries using Insulated Over Silicon (FD-SOI) for mobile devices and Internet of Things (IoT) applications. According to EE Times Asia, Intel said its 22FFL is the first low-power IoT application on the market