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本文叙述了用无银中温钎料QCu12Z的钎焊接头进行的各种机械性能及电性能试验。认为无银中温钎料与银基钎料的接头相比。其接头的抗拉,抗剪强度相差不大,而弯曲角相差较多;电参数测试达产品电性能要求;接头与母材的镀银色泽一致性好。因此无银中温钎料可用于母料为铜及其合金的搭接接头且不承受或承受较小弯曲、冲击、振动载荷的微波器件等产品之中。
This article describes various mechanical and electrical properties tests performed on soldered joints of silver-free solders QCu12Z. The silver-free solder is considered to be comparable to silver-based solder joints. The tensile strength and shear strength of the joints are not different, but the bending angle is quite different. The electrical parameters are required to meet the electrical performance requirements of the products. The consistency of silver-plated joints between the joint and the base metal is good. Therefore, silver-free medium temperature solder can be used for the masterbatch of copper and its alloy lap joints and do not bear or bear less bending, impact, vibration load microwave devices among other products.