论文部分内容阅读
不同抗弯强度硅片高温弯曲度变化的实验结果表明，众多因素对抗弯强度和高温弯曲度的影响规律是一致的．高温翘曲度或弯曲度与抗弯强度有内在联系．抗弯强度不仅表示硅片在常温下的抗破碎能力，而且也反应了高温抗翘曲和弯曲能力．
Experimental results show that the influence of many factors on bending strength and bending at high temperature are consistent. High temperature warpage or bending and bending strength are intrinsically linked. Flexural strength not only means that the silicon chip at room temperature, crushing capacity, but also reflects the high temperature anti-warping and bending capabilities.