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随着计算机和半导体工艺的发展,PCB尺寸的增大,组件块数的增加,尤其组件集成度的提高,LSI和VLSI的出现与普及,使得PCB越来越复杂。例如,一块PCB可能包括两个或多个处理器。有时为了提高处理器的响应速度,提高功能,把比较复杂的微处理器与事先考虑好的集成块(IC)集中在一个单片上。这就对计算机的测试提出了挑战。PCB的正确性与可靠性就更为重要。而PCB的测试速度与质量直接关系到机器的效率和可维修性。用原始的Card-edge测试方法越来越困难。所以,近些年来,PCB的测试技术发展很快。在测试方法上产生了变革,研制出各种类型的测试设备,可以测试电路,模拟电路,还可以测试比较复杂的混合电路,A/DC、D/AC以及CODEC。从集成度上讲,可以测试SSI,MSI,LSI和VLSI,从电路上讲,可以测试ECL,CMOS和TTL等。
With the development of computer and semiconductor technology, the increase of PCB size, the increase of the number of components, especially the increase of component integration, the emergence and popularization of LSI and VLSI make the PCB more and more complicated. For example, a PCB may include two or more processors. Sometimes in order to improve the response speed of the processor, improve the function, put the more complicated microprocessor and preconceived good integrated block (IC) on a single chip. This poses a challenge to computer testing. PCB accuracy and reliability is even more important. The test speed and quality of the PCB are directly related to the efficiency and maintainability of the machine. With the original Card-edge test method more and more difficult. Therefore, in recent years, PCB testing technology developed rapidly. In the test method has changed, developed a variety of test equipment, you can test the circuit, analog circuits, you can also test more complex hybrid circuits, A / DC, D / AC and CODEC. In terms of integration, you can test SSI, MSI, LSI and VLSI, from the circuit, you can test ECL, CMOS and TTL.