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塑料封装晶体管框架,过去均用复合模单件冲制,现改用连续冲模冲制。 一、样品的测绘、分析和排样图的确定 1.对国外样品进行测绘。样品见图1。材料96黄铜,是一种厚薄型材。尺寸要求见图二,厚度偏差为0.05毫米,厚薄交界处呈直角,厚度为1.3的侧面不进行加工,0.4厚侧面有侧刃冲裁痕迹。样品件间距离为11.4毫米,侧刃长度为22.8毫米,脚宽0.8毫米,间距2.54毫米,是公英制混合尺寸,件间距
Plastic encapsulated transistor frame, in the past are used composite die stamping, is now converted to continuous punching. First, the sample mapping, analysis and layout of the map to determine 1. Foreign samples for mapping. Sample shown in Figure 1. Material 96 Brass is a thick profile. Size requirements shown in Figure II, the thickness deviation of 0.05 mm, the thickness of the junction at right angles to the thickness of 1.3 on the side without processing, 0.4 side profile blanking blanking traces. The distance between sample pieces is 11.4 mm, the side edge length is 22.8 mm, the foot width is 0.8 mm and the pitch is 2.54 mm. It is a metric-inch mixed-size,