论文部分内容阅读
文章对贮能焊封装过程中管壳的受力状态进行了分析，给出了各结合层残余应力的计算结果，结果表明：管壳的翘曲度对电路内部各结合层受力装态的影响很大。
The article analyzes the stress state of the shell during the process of ESW packaging, and gives the calculation results of the residual stresses of the bonding layers. The results show that the warpage of the shell affects the stress loading of the bonding layers in the circuit great influence.