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器件尺寸正在对半导体加工工艺从多方面提出新的挑战。对于在90nm节点之后的应用,需要更大改进,且用适应性强的先进工艺来克服更大节点工艺中已得到验证的固有技术的限制。不仅基于先进工艺控制(APC)的下一代工艺设备能够得到来自一个以上信息来源的测量数据,而且将这些测量数据转换成为工艺控制参数以减少性能变化,下一代工艺设备必须提供生产线许多表明圆片经过工艺设备的整个控制程序特性。这种先进工艺控制系统将给予生产线高度理想的、适合先进工艺控制的适应能力需求,实现对其独特的生产线提供最大的优势。
Device size is presenting new challenges for semiconductor processing technology in many ways. For applications beyond the 90 nm node, much more improvement is required and advanced adaptive techniques are used to overcome the limitations of the proven inherent technology of larger node processes. Not only will next-generation process equipment based on Advanced Process Control (APC) be able to obtain measurement data from more than one source of information, but also to convert these measurement data into process control parameters to reduce performance variations, the next generation of process equipment must provide the production line with many indicating wafers After the entire process control equipment program features. This state-of-the-art process control system will give the production line a highly desirable, adaptable capability for advanced process control, providing the greatest advantage to its unique production line.