今天,电子学正向固体化、微型化、集成化、高可靠方向发展。电子学向这个方向发展的支柱是半导体器件及集成电路。半导体器件及集成电路能起到这种支柱作用,在相当大程度上要归功于平面工艺。平面工艺使半导体器件由分离器件发展成为集成电路、大规模集成电路、超大规模集成电路。平面工艺找到了一整套在硅片上进行微细加工的方法,包括微细线条的制作,金属薄层、介质薄层和掺杂/不掺杂半导体薄层的制 Today, electronics is solidified, miniaturized, integrated, highly reliable direction. The pillars of electronics in this direction are semiconductor devices and integrated circuits. Semiconductor devices and integrated circuits can play such a pillar, in large part due to the planar process. Flat-panel process to the development of semiconductor devices from the separation device into an integrated circuit, large-scale integrated circuits, VLSI. The planar process found a complete set of methods for microfabrication on silicon wafers, including the fabrication of fine lines, the fabrication of metal thin layers, dielectric thin layers, and doped / undoped semiconductor thin layers