现今人们已知道,陶瓷材料除了具有耐高温和化学性质稳定的特点外,在电、热、光、磁、声等方面也具有优异的性能,发展了许多功能陶瓷材料。随着微电子学、集成光学、光通信、太阳能利用等领域的大力开拓,材料的薄膜化受到极大重视,这就促使各种金属、非金属薄膜沉积技术迅速发展。其中等离子反应薄膜沉积术,是在许多原来已成熟的薄膜沉积技术中,应用了等离子体技术而发展起来的;因而方法种类最多、应用最广,发展也最快。一、等离子反应薄膜沉积术的分类参与“等离子反应”的薄膜沉积技术,大致可以分为溅射、离子镀、等离子化学气相沉积、等离子表面改性及聚合等几类,而每一类又可分为若干种方法,如表1所示。二、等离子化学气相沉积基本原理及特征在室温或较低温度(一般<500℃),从外 Nowadays, it has been known that ceramic materials have excellent properties in terms of electricity, heat, light, magnetism and sound as well as high temperature stability and chemical stability. Many functional ceramic materials have been developed. With the development of microelectronics, integrated optics, optical communications, solar energy utilization and other fields, great attention has been paid to the thinning of materials, prompting the rapid development of various metal and nonmetal thin film deposition technologies. Among them, plasma reactive thin film deposition is developed in many original thin film deposition techniques using plasma technology. Therefore, the method is the most widely used, the most widely used and the fastest growing. First, the classification of plasma reactive thin film deposition involved in the “plasma reaction” of the thin film deposition technology, can be roughly divided into sputtering, ion plating, plasma CVD, plasma surface modification and polymerization and several categories, and each category can Divided into several methods, as shown in Table 1. Second, the basic principles and characteristics of plasma chemical vapor deposition at room temperature or lower temperature (usually <500 ℃), from outside