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采用液固分离法制备了Al-65vol%Si电子封装材料,借助扫描电镜、透射电镜等手段分析了合金中Si相的形态分布、界面及断口形貌,测定了合金的热膨胀系数、热导率及抗弯强度。结果表明:Al-65vol%Si合金组织中硅相颗粒分布均匀,形状规则呈近团球状和短杆状,Al/Si两相界面光滑、平直,无缺陷。合金密度2.4 g/cm3,室温下的热导率(TC)为119.5 W/(m.K),热膨胀系数(CTE)从50℃到400℃在6.5×10-6～11.3×10-6/K范围内稳定增加,抗弯强度为132 MPa,Si相的脆性断裂为主要断裂方式。Al-65vol%Si合金性能满足电子封装要求。
Al-65vol% Si electronic packaging material was prepared by liquid-solid separation method. The morphology distribution, interface and fracture morphology of Si phase were analyzed by scanning electron microscopy and transmission electron microscopy. The thermal expansion coefficient, thermal conductivity And bending strength. The results show that the particles of silicon phase in Al-65vol% Si alloy have uniform distribution, nearly spherical shape and short rod shape. The interface of Al / Si phase is smooth, flat and defect-free. The alloy has a density of 2.4 g / cm3, a room temperature thermal conductivity (TC) of 119.5 W / (mK) and a coefficient of thermal expansion (CTE) of from 50 ° C to 400 ° C in the range of 6.5x10-6 to 11.3x10-6 / K The internal stability increases, the flexural strength is 132 MPa, and the brittle fracture of Si phase is the main fracture mode. Al-65vol% Si alloy performance to meet the electronic packaging requirements.