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研究了稀土氧化物颗粒增强复合无铅钎料Sn-3Ag-0.5Cu-Y2O3的钎焊接头的显微组织形貌、性能特点及有关影响机制。结果表明:Y2O3增强颗粒均匀分布于Sn-3Ag-0.5Cu钎料基体中,不仅细化了钎焊接头中共晶相Ag3Sn和Cu6Sn5相颗粒尺寸,而且也显著提高了钎焊接头的剪切强度。另外适量Y2O3颗粒的添加对钎料润湿性影响不大。
The microstructure, properties and properties of the Sn-3Ag-0.5Cu-Y2O3 brazing joint reinforced with rare earth oxide particle-reinforced composite lead-free solder were studied. The results show that Y2O3 reinforced particles are uniformly distributed in the Sn-3Ag-0.5Cu solder matrix, which not only refine the grain size of the eutectic phases Ag3Sn and Cu6Sn5, but also significantly improve the shear strength of the brazed joints. Addition of appropriate amount of Y2O3 particles on the solder wettability little effect.