为了光电子器件和互补金属氧化物半导体（ＣＭＯＳ）电路的进一步集成，贝尔实验室－朗讯技术公司的研究人员已演示他们称为能实现每激光器每秒千兆比特性能的第一个倒装晶片粘合ＣＭＯＳ／垂直腔面发射激光器（ＶＣＳＥＬ）列阵。研究人员把他们以前的砷化镓多量子阱调制列阵 For further integration of optoelectronic devices and complementary metal oxide semiconductor (CMOS) circuits, researchers at Bell Labs - Lucent Technologies have demonstrated what they call the first flip chip die to achieve gigabit per second performance per laser CMOS / Vertical Cavity Surface Emitting Laser (VCSEL) array. Researchers put their previous GaAs MQW array