近日,两种面向逻辑、RF应用及分立功率器件的封装在超薄无铅封方面取得重大突破,这两种封装是由Philips Semiconductors公司推出的。其中,Mi-croPak是世界上最小的无铅逻辑封装,仅1.0mm2,焊垫间距为0.35mm。而面向分立功率器件和RF应用的Philips SOD882T封装则更小,仅为0.6mm2, Recently, two kinds of packaging for logic, RF applications and discrete power devices made major breakthroughs in ultra-thin leadless packages, both of which were launched by Philips Semiconductors. Among them, Mi-croPak is the world’s smallest lead-free logic package, only 1.0mm2, pad spacing of 0.35mm. The Philips SOD882T package for discrete power devices and RF applications is even smaller, at 0.6mm2,