本文讨论工艺技术,以声表面波器件用的微米和亚微米线宽的叉指电极为议题,概括了国外声表面波器件工艺技术的现状,从声表面波器件实际需要的角度分析了曝光系统、制版方法、实用光刻胶、多层掩模、无机光刻胶、干法刻蚀技术、铌酸锂的刻蚀技术及干法显影等问题,评述了发展声表面波器件的工艺技术途径。 This article discusses the process technology, the surface acoustic wave device with micron and sub-micron line width of the interdigital electrode as the topic, summarizes the status quo of foreign SAW device technology, the surface acoustic wave device from the practical needs of the analysis of the exposure system , Plate making methods, practical photoresists, multi-layer masks, inorganic photoresists, dry etching techniques, lithium niobate etching techniques, and dry development techniques are reviewed. The technological approaches to the development of SAW devices are reviewed .