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研究了铜合金 - Q195 -铜合金三层复合板室温轧制成形工艺 ,借助金相显微镜、扫描电镜、电子探针分析了复合板的结合机制
The forming process of the copper alloy-Q195-copper alloy three-layer composite board at room temperature was studied. The bonding mechanism of the composite board was analyzed by means of metallographic microscope, scanning electron microscope and electron probe