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在研发成功低吸水性分子主链和捕捉金属离子型树脂的基础上,研制成功了绝缘可靠性优良的薄型IC封装用无卤素覆铜板基材。因为这种材料当绝缘层厚度为40μm时就有良好的绝缘可靠性,所以能实现厚度为100μm封装结构基板。而且在无卤素的情况下能达到UL94-V0级的阻燃性,并能做到符合环保要求的无铅焊锡装配。
Based on the successful development of the low water absorption molecular backbone and the capture of metal ion resin, a halogen-free copper clad laminate for thin IC packaging with excellent insulation reliability was successfully developed. Since this material has good insulation reliability when the insulating layer has a thickness of 40 μm, a package substrate having a thickness of 100 μm can be realized. And in the case of halogen-free to UL94-V0 grade flame retardant, and can meet the environmental requirements of lead-free solder assembly.