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本文介绍一种对微波器件实现无边缘封帽的方法.利用超声热压方法来完成对超小型微波器件的无边缘封帽,结果表明用这种方法封帽后的器件其气密性(即漏气率Q≤10~(-6)托升/秒),成品率能达到90%以上,并能通过C级的振动、冲击、离心、变频、热冲、温度循环、加速热潮等项可靠性考核.同时对封帽后的器件进行了抗折强度和抗拉强度的试验.结果表明封帽边缘的抗折强度和抗拉强度高达200公斤/厘米~2,大大地超过了器件本身对管壳所提出的强度要求.采用本法对微波器件实现无边缘封帽,无需对器件管芯加热,使用的超声功率仅为0.3瓦左右,管帽受热时间仅为3秒到5秒,封管温度为340℃到360℃,因此,对器件的性能毫无影响.实践证明,本文所介绍的方法完全可以应用于微波超小型器件的封帽,并且具有效果好、封帽速度快等一系列优点.目前本法已应用到某些同轴型和微带型器件的产品定型和批量生产之中.
In this paper, we introduce a method of edgeless caps for microwave devices.Using ultrasonic hot pressing method to complete the edgeless caps of ultra-small microwave devices, the results show that the gas-tightness of the devices after sealing cap by this method Leak rate Q≤10-6 (T) / L), the finished product rate can reach more than 90%, and can pass C grade vibration, shock, centrifugal, frequency conversion, thermal shock, temperature cycling, acceleration boom and other items reliable The results of the tests show that the flexural strength and tensile strength of the edge of the cap reach as high as 200 kg / cm ~ 2, which greatly exceeds that of the device itself The strength requirements put forward by the shell.Using this method to achieve a borderless cap for microwave devices without heating the device die, the ultrasonic power used is only about 0.3 watts, the cap heats only for 3 seconds to 5 seconds, The tube temperature is 340 ℃ to 360 ℃, therefore, has no effect on the performance of the device.Practice has proved that the method described in this article can be fully applied to the caps of microwave ultra-small devices, and has good effect, Series of advantages. At present, this law has been applied to certain coaxial type Product type and batch type device in microstrip.